Background

Silver is the main material for metallization of solar cells. The global silver demand for photovoltaics in 2023 has reached a record 190 million ounces, a significant increase from 100 million ounces in 2020, accounting for about 30% of industrial silver demand. Reducing the amount of silver is an important means to reduce the cost of solar cells, including copper plating, silver coated copper, busbar free (0BB), copper paste/aluminum paste, ultra-fine line printing and other technical routes. Under the fierce competition in the photovoltaic industry, enterprises and scientific research institutions actively explore the R&D and industrial application of photovoltaic silver reduction/silver free technology.

Copper plating technology has great potential. In June 2024, Tongwei overcame key core technologies such as mass production technology for 15 μm copper gate lines, flexible contact continuous electroplating, and copper gate line HJT cell interconnection on the GW level HJT pilot line. In September 2024, JBAO collaborated with a leading TOPCon enterprise on TOPCon copper electroplating using efficient electroplating line mass production technology. Aiko pioneered the silver free metal gate line coating technology, using electrochemical and chemical means to copper, nickel, and tin plating as well as achieved comprehensive process effects beyond printing silver paste on a 10GW scale production line.

The use of silver coated copper powder paste significantly reduces the silver content, thereby effectively reducing the metallization cost of photovoltaic cells. The localization of silver coated copper paste and the long-term reliability of cells are key concerns in the industry. In May 2024, Huasun applied advanced technologies such as texturization production, bifacial microcrystals, 0BB, and silver coated copper paste to achieve an average efficiency of 26.15% in mass production of G12 cells. In July 2024, Anhui Silwei, the core supplier of Huasun paste, achieved the first delivery of local silver coated copper paste in Xuancheng.

0BB metallization can improve module efficiency and reduce silver paste usage, mainly through two methods: film coating and welding. Busbar free metallization can improve component efficiency and reduce silver paste usage, mainly through two methods: film coating and welding. In April 2024, X’N won the bid for the annual production of 5GW non main grid components project at Chint Astronergy Fuyang Base. In September, Astronergy Fuyang Base successfully achieved mass production and shipment of ZBB-TOPCon large-scale products. Scenergy has launched the composit finger technology and signed a contract with Tongwei in September 2024 to carry out technical cooperation and development, as well as post production plans for composit finger module technology.

Solar Cell Silver Reduction/Silver Free Technology Innovation Forum 2024 will be held on November 8 in Suzhou, Jiangsu, China. The conference will discuss the prospects of the photovoltaic industry and the market prospects of silver reduction/silver free technology, photovoltaic copper plating technology route, equipment selection, process difficulties and demonstration project experience, silver coated copper powder production process and silver coated copper paste application, 0BB series welding equipment, adhesive, laminating equipment and grid line carrier film, replacing silver paste copper paste and aluminum paste technology R&D. Ultra-fine line printing technology and matching advanced screen plate and paste.This conference will provide ZOOM Global Online Participation and simultaneous interpretation in Chinese and English.

Topics

1. Outlook for the Photovoltaic Industry and Market Prospects for Silver Reduction /Silver Free Technologies

2. HJT, TOPCon, and XBC cell low/no silver metallization processes

3. Long term reliability of copper electroplating, silver coated copper, and 0BB module

4. Photovoltaic Copper Electroplating Technology Route-Vertical Slot Machine and Horizontal Chain Machine

5. Selection of copper electroplating equipment-seed layer preparation, patterning, metallization, and post-treatment

6. Analysis of Difficulties in Copper Electroplating Process- Yield, Uniformity, Fragmentation Rate, and Energy Consumption

7. Operation and Demonstration Experience of Copper Electroplating Pilot Line for Photovoltaic Cells

8. 0BB Copper Grid Line Photovoltaic Cell Interconnection Technology

9. Copper electroplating process wastewater treatment and environmental protection solutions

10. Production process of high reliability silver coated copper powder

11. Application Practice of Silver Copper Paste in HJT Cells

12. Technology and equipment for laminated series connection of 0BB cells

13. Gate line carrier film serving 0BB process

14. 0BB string welding technology and welding equipment

15. Application of Adhesive in 0BB Process

16. Analysis of the advantages and prospects of composit finger module technology

17. Integrated development of photovoltaic ultrafine copper powder and copper paste

18. Research and industrial application of antioxidant high conductivity copper paste technology

19. Competitive analysis of aluminum paste in XBC cells

20. Ultra fine line printing technology, advanced screen and paste matching

Program

Nov. 7

17:00-20:00  Pre-conference Registration 

Nov. 8

08:30-12:30  Speech

12:30-14:00  Networking Lunch

14:00-18:30  Speech

18:30-20:00  Banquet